Comprar un móvil de 700 euros o no comprarlo, esa es la cuestión

¿Son demasiado caros los móviles? Es una pregunta difícil de responder. Para muchos usuarios, gastarse 700 u 800 euros en un móvil es normal. Para otros no lo es tanto, aunque muchas veces acaban pagando estas cifras, seducidos por un modelo determinado de smartphone. Por último, están los que en ningún caso comprarían un smartphone tan caro. ¿Tiene sentido comprar un teléfono inteligente de 700 euros?

via Tecnología en español. Comparativas, tutoriales, trucos, ayudas, paso a paso, cómo – Últimas noticias

Pebble Time ya está aquí

Han tenido que pasar unos cuantos años desde que se lanzara el primer “reloj inteligente” hasta encontrar el primero que hace honor, realmente, a su adjetivo. Todavía está por decir si el reloj puede pensar de verdad. Pero al menos sí sabemos que ha sido diseñado de manera inteligente. El Pebble Time podría tener mucho que decir de cara al futuro.

via Tecnología en español. Comparativas, tutoriales, trucos, ayudas, paso a paso, cómo – Últimas noticias

¿Son necesarias las tarjetas SIM?

Si habéis comprado hace poco un móvil o un tablet, os habréis dado cuenta de que para iniciarlo tenéis que configurarlo, y es necesario contar con una cuenta en uno de los servicios del fabricante o del desarrollador del sistema operativo. Si es un Android, una cuenta de Google, o si es un iPhone, una cuenta de Apple. Resulta difícil pensar que sea posible hoy en día utilizar un smartphone o un tablet sin tener una de estas cuentas. Lo sorprendente es que a día de hoy, todavía utilicemos las tarjetas SIM. ¿Son realmente necesarias?

via Tecnología en español. Comparativas, tutoriales, trucos, ayudas, paso a paso, cómo – Últimas noticias

AMD G-Series SoC Powers Fujitsu’s Next Generation Mini-ITX System Design

The mini-ITX is a popular low power, 17×17 cm motherboard form factor that has been powering a whole range of designs, from complete system solutions for industrial customers to embedded PCs, which include Digital Signage and Thin Client applications, for over a decade now. Fujitsu Technology Solutions, an industry trusted system solution provider and leading vendor of industrial mainboards, once again turned to AMD Embedded G-Series SOC solutions to power their next generation Mini-ITX system design.


System solution providers look at a number of different elements when making purchasing decisions around new generation technologies to ensure they are optimizing their system solutions around Total Cost of Ownership (TCO).


The pin compatibility in hardware within the AMD Embedded G-Series SOC family across two generations is one of many key contributing factors that enabled customers like Fujitsu to extend their coverage. Our2nd generation product line, codenamed “Steppe Eagle”, gives customers true system scalability in their offerings and takes advantage of not only performance gains but realizes unique feature add-ons like support for configurable TDP (cTDP). In short, the enhanced power management features coupled with two generations of scalable offerings from AMD give hardware and system engineers flexibility in design with respect to thermals while minimizing costs.


Another important trend taking shape in Factory Automation is remote management. Remotely accessing enterprise servers and office computers for system health monitoring and maintenance have been a critical function within the IT infrastructure for many years. But these same systems have largely eluded embedded systems on the factory floor due to high costs of implementation and deemed resource intensive… until now. Many of the leading OEMs believe we are in the midst of the 4th industrial revolution or Industry 4.0. Some affectionately call it the “Internet of Things of the Factory Floor”. The end goal for OEMs is to deliver a smart, intelligent and a connected factory floor. Remote management serves as a key enabler to deliver on the promise of a highly intelligent and sustainable factory floor. Factory floor workers can monitor system operations, push software/BIOS updates on the network remotely, among numerous other tasks, driving overall operational efficiency and maintaining factory uptime. AMD, an advocate for proprietary-free open-source solutions, adopted the Desktop and mobile Architecture for System Hardware (DASH) as the ‘gold standard’ for Remote Management. For more information on AMD’s DASH implementation and supporting reference design, check out the webinar from my colleague Cameron Swen and white paper on AMD’s remote management implementation. More details on our own DASH implementation are available via AMD’s Embedded Developer Site. Solution providers like Fujitsu quickly saw the value in an ‘open-source’ royalty free implementation of DASH for remote management for applications like Digital Signage. With mobility on the rise, more customers are looking at differentiated technologies like Remote Management to deliver on their vision for the future.


This leads me to the next parameter in the TCO equation: supply. At AMD Embedded Solutions, we continue to listen to our customers’ pain points around their system solution. One recurring theme for Industrial customers is product shelf life and availability. AMD Embedded Solutions has developed a focused Product Longevity Program spanning APUs, SOCs and dGPUs to better serve our broader embedded customer base. The longevity program delivers a supply assurance program eliminating the need to do costly refreshes due to EOL product lines and further builds the relationship with AMD as a trusted partner delivering an optimized TCO solution.


Sameer Gupta is segment marketing manager, industrial controls and automation for AMD Embedded Solutions. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites, and references to third party trademarks, are provided for convenience and illustrative purposes only. Unless explicitly stated, AMD is not responsible for the contents of such links and no third party endorsement of AMD or any of its products is implied.

via AMD Blogs

How Do They Do That?

There have been several successful television shows dedicated to understanding the many great feats of engineering that have been accomplished. Medical breakthroughs, space exploration, technological marvels; we are fascinated by what we have been able to achieve. At the 2015 International Solid-State Circuits Conference (ISSCC) conference, AMD revealed details on how we accomplished our latest engineering marvel – the upcoming “Carrizo” Accelerated Processing Unit (APU). The semiconductor industry has long relied on axioms of process technology, such as Moore’s Law and Dennard scaling, to drive improvements in device power and performance.  As these laws become more challenging, AMD is responding by implementing a wealth of power management and architecture improvements that in many cases deliver even greater benefit than traditional technology scaling. So, how do we do that?


Carrizo Real-estate

The new “Carrizo” microprocessor will include four “Excavator” processor cores and powerful AMD Radeon™ Graphics Core Next (GCN) cores.  With approximately the same area footprint as its predecessor “Kaveri”, “Carrizo” fits 29% more transistors (3.1 billion) onto a die. By utilizing a high-density library design, “Carrizo” achieves a 23% area reduction for the “Excavator” cores while still providing more transistors and more instructions per clock (IPC). The thermal density challenge of the smaller “Excavator” core is mitigated through intelligent floorplan placement and the use of lower leakage transistors. The area reduction for the cores enabled a larger area of the chip to be allocated for graphics, multimedia, and the integration of southbridge and AMD Secure Processor logic onto the APU. The increased footprint for graphics intellectual property (IP) was used to improve the compute performance of “Carrizo,” which is designed to be the world’s first heterogeneous system architecture (HSA) 1.0 compliant part. The multimedia IP has been enhanced with a new high-performance video decoder and double the video compression engines of “Kaveri”. This larger multimedia engine can transcode nine real-time 1080p video streams, an impressive 3.5× improvement over “Kaveri”.


Energy Efficiency and Power Consumption

HSA innovation from AMD saves energy by eliminating connections between discrete GPU and CPU processors, reduces computing cycles by treating the CPU and GPU as peers, and enables the seamless shift of computing workloads to the optimal processing component. HSA allows many workloads to execute more efficiently using GPU compute resources in addition to CPU resources providing better performance at the same energy consumption. Additionally, “Carrizo” moves the GCN cores to a separate conditionally-enabled power supply. This allows the graphics cores to operate at their optimal voltage, which can give a 20% power improvement over “Kaveri” with six GCN cores. “Excavator” supports AMD’s first implementation of adaptive voltage-frequency scaling (AVFS), an improved version of other adaptive voltage approaches. AVFS allows each part to self-calibrate and determine the optimal voltage for current operating frequency and conditions. Timing-margin prediction vs. actual timing margin indicates the ability of AVFS to set the minimum voltage required across the entire voltage range, resulting in up to 30% power savings. The full implementation cost of AVFS is under one percent of the core area. In addition to the area reduction, the “Excavator” core has achieved program goals by reducing power versus the previous “Steamroller” core by 40%!


So… How do we do that?

Through a multitude of impressive optimizations, AMD has been able to combine four “Excavator” cores, eight Radeon™ GCN cores, the southbridge, AMD Secure Processor technology for enterprise-class security and a HSA-1.0 design on a single “Carrizo” APU.  The new “Excavator” cores are smaller, more powerful and more energy efficient than the previous generation. The power optimized GCN graphics cores provide impressive performance-per-watt improvements. HSA capabilities enable new, more efficient applications. Multimedia throughput is improved by 3.5x, and hardware support for H.265 decode is included.  All of this is done without a change in process technology, and while holding the die size flat generationally. “Carrizo” is truly a feat of engineering, a great step toward AMD’s 25×20 energy efficiency goal and a testament to the AMD commitment to deliver great products.


To dig further into the details, check out the ISSCC 2015 AMD press release and presentation on the ISSCC page of the AMD website.


Kevin Lensing is Sr. Director, Client Product Management, Computing and Graphics for AMD. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites are provided for convenience and unless explicitly stated, AMD is not responsible for the contents of such linked sites and no endorsement is implied.

via AMD Blogs

The Industrial Internet is transforming businesses

Guest Post By Tommy Swigart, Global Product Manager COMExpress, GE Intelligent Platforms


At GE, we’ve already invested over $1 billion in making the Industrial Internet a reality. It’s here and now – and it’s transforming businesses around the world. Of course, its continued growth won’t be as the result of a single company’s effort and investment; rather, it will be because companies have worked together. No single company has every piece that’s needed.


Here’s a case in point. At GE, we’ve identified COM Express technology as a key building block within an infrastructure that brings together advanced computing, analytics, low cost sensing and new levels of connectivity. COM Express has three highly desirable attributes. It’s modular and easily upgradable; it’s an open standard; and, in the right hands, it’s capable of withstanding the rigors of deployment in the harshest industrial – and military – environments. That’s why COM Express is at the heart of GE’s next generation industrial PCs and automation controllers – machines that will deliver the underlying intelligence that will help drive the Industrial Internet.


One of the other beauties of COM Express technology is that it’s processor-agnostic; it can be a carrier for virtually any processor, making it hugely flexible and adaptable.


So: a customer came to GE, looking for a very challenging solution. He needed something with all the attributes of COM Express. He needed, however, to pair the COM Express carrier with a processor with very low power consumption – but with substantially more capability than is typically available from processors designed for such applications. The customer also needed the most compact package possible.


Not only that: rugged reliability, with maximum possible MTBF (mean time between failure), was also crucial to his application.


At GE, we’re fortunate to have a very close working relationship with AMD, and we were aware of AMD’s plans to launch their G-Series System-on-Chip (SoC). It had the attributes that we – and the customer – were looking for. Not only did it deliver the high performance/low power consumption needed by the application, but it also included much of the functionality that would otherwise need to be implemented on the underlying COM Express carrier. The impact of this, of course, is that the lower component count increases MTBF.


And so it was that the mCOM10-L1500 was born – a result of close cooperation between the teams at AMD and GE. AMD’s G-Series technology provided a combination of functionality and performance characteristics that enabled the development of a product uniquely suited to customer demands.



The Mini COM Express module mCOM10-L1500 offers high performance and ultimate durability needed for applications that operate in harsh environments.

The inherent reliability of the AMD G-Series SoC is complemented by GE’s fully rugged design. Onboard components are specifically selected for their reliability in demanding conditions, and are soldered to the board for maximum resistance to shock and vibration, while extended mechanical construction protects the module. The mCOM10-L1500 is also designed to accept conformal coating for even greater resistance to moisture, dust, chemicals and extremes of temperature.


Like all COM Express-based designs, the mCOM10-L1500 delivers lower lifetime cost of ownership, because upgrades to the processor – in response to changing application demands, or to leverage new generations of price/performance – are straightforward and minimize cost. It is also the case that, as the underlying carrier card that provides the required interfaces to the system does not need to be replaced at the time of upgrade, testing and requalification time, effort and expense are minimized.


A single, new product developed by the teams at GE and AMD will not, in itself, ensure the continuing growth of the Industrial Internet. It will take hundreds – thousands – tens of thousands – of additional new building blocks – but products like the mCOM10-L1500 will make a vital contribution to our growing ability to connect people, data and machines.



Tommy Swigart can be contacted at


Tommy Swigart is Global Product Manager COMExpress at GE Intelligent Platforms. His postings are his own opinions and may not represent AMD’s positions, strategies or opinions. Links to third party sites, and references to third party trademarks, are provided for convenience and illustrative purposes only. Unless explicitly stated, AMD is not responsible for the contents of such links, and no third party endorsement of AMD or any of its products is implied.

via AMD Blogs

Microsoft Signature Edition PCs, los Windows con mejor funcionamiento

En el mundo de Android existe lo que se denomina Bloatware, y que consiste en todo el software que el fabricante u operador instala en el smartphone adicionalmente al sistema operativo. ¿Pasa esto en los ordenadores? Así es, y de manera más frecuente que en los smartphones. Pero eso se acabará con los Signature Edition PCs.

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